Dr. Werner Bergholz



Professor of Electrical Engineering
School of Engineering & Science - SES
Electrical Engineering and Computer Science
Mailing Address:

Campus Ring 1
28759 Bremen
Germany

Email: w.bergholz@jacobs-university.de
Telephone: +49 421 200-3111
Fax: +49 421 200-3103
Office: Research I, Room 50
Research Interests:
  • Silicon wafer material developement strategies for sub 100nm design rules
  • Fast destruction-free defect detection in semiconductors
  • Microelectronics (Device failure mechanisms, reliability testing)
  • Industrial Engineering and Quality Management
  • Microelectronics as the enabling technology for the emerging visual mass  communication
University Education:
  • Diploma in Physics in 1975
  • Dr. rer. nat. in Physics in 1978, both at Göttingen University
Fellowships and Awards:

Fellowship of the Royal Society for post doc studies in Oxford 1983 - 19

Other Professional Activities:
  • Co-Chairman of the SEMI European Regional Standard Committee
  • Co-Chairman of the SEMI European Technical Committee for Si wafers
  • Consulting for Si wafer manufacturers and Microelectronic Corporations
Research and Teaching Positions:
Assistant Professor in Göttingen University from 1978 - 1983 (from 1985 - 2002 various positions in Siemens, Infineon Technologies, including teaching duties for newly hired engineers)
Publications:
  • H. Tews, J. Wittmann, R. Fehlhaber, W. Bergholz, "Cost vs. Benefit and Other Factors for the Successful Implementation of New Wafer Types", invited paper for Symposium "Si with Functional Layers", Semicon Europa April 3rd 2003, http://www.semi.org/web/wcontent.nsf/url/stds_EU_Siliconworkshop200
  • W. Bergholz, J. Wittmann, H. Tews, R. Fehlhaber, "Cost vs. Benefit and Other Factors for the Successful Implementation of New Wafer Types", Proc. Freiberger Siliciumtage "Halbleitermaterialien, Prozesstechnologie und Diagnostik", 19.- 20. 6. 2004, Freiberg
  • W. Bergholz, J. Wittmann, R.Winkler, H. Tews, R. Fehlhaber, "Prospects for New Wafer Types and Materials in Semiconductor Technology and Factors for their Successful Introduction", Solid State Phenomena 95-96, Transtech Publications, Switzerland, p 665 - 674 (2004)
  • W. Bergholz, J. Wittmann, H. Tews, R. Fehlhaber, "Next Generation Silicon Wafers" in: Business Briefing: Global Semiconductor Manufacturing & Technology 2003” Word Markets Series, August 2003
  • H.P. Ehweiner, W. Bergholz: "New Technologies on Second Hand & Existing Equipment", in "SEMI Fall Conference: Standards -The Basis for Cost-Effective Implementation of New Technologies", Nijmegen Oct. 2003
  • C. Lee, W. Bergholz, B. Weiss, "Paving the Way for New Technologies", Semiconductor Manufacturing 4, 172 2003
  • W. Bergholz and B. Weiss, "SEMI Standards and Quality Function Deployment" SEMI Autumn Conference"Future Applications - Future Standards", Vimercate, Italy 7th Oct 2004
  • W. Bergholz, J. Wittmann, H. Tews, "Future trends of wafer types and materials in ULSI technology", Invited Paper 4th International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium), Nov. 22-26, 2004,Kona, Hawaii, USA
  • W. Bergholz, B. Weiss and C. Lee: "Quality Function Deployment as a way to improve the Creation of Standards", Semiconductor Manufacturing Magazine April 2005
  • J. Wittmann and W. Bergholz, "Wert der Bewertung", Qualität und Zuverlässigkeit 51, p 38 - 42 (2006)
  • W. Bergholz, B. Weiss and C. Lee, "Benefits of Standardization in the Microelectronics Industry and its implications for Nanotechnology and other Innovative Industries", in "International Standardization as a Strategic Tool", Commended Papers from the IEC Centenary Challenge 2006, p35 - 50
  • W. Bergholz, "Material and Structural Integrity in Nanoelectronics Products and Beyond", Int. J. Materials and Structural Integrity", Int. J. Materials and Structural Integrity, Vol. 1, Nos. 1/2/3, 2007, p30 - 50
  • T. Adler, W. Bergholz and N. Fabricius, "ISO and IEC Standardization Activities in the Field of Nanotechnology", 13th Micromachine Summit, Venice, Italy, April 25 - 28, 2007
  • W. Bergholz, "Photovoltaics Challenges", in PhotoVoltaics (PV) Workshop "Challenges in High-Volume Manufacturing of PV Products", SEMICON West 2007, July 17th, 2007
  • W. Bergholz: "Wafer Thickness Considerations", Discussion Paper for the 1st Meeting of the SEMI 450mm Handling Wafer Standardization Task Force, San Francisco, July 18th, 2007
  • W. Bergholz, N. Fabricius, G. Weking, "IEC Nanotechnology Standardization TC113: Nanotechnology Standardization for Electrical and Electronic Products and Systems in the Field of Nanotechnology", invited paper for 6th Silicon Wafer Standards Workshop: "Si Wafer Trends and Requirements Going Forward", Semicon Europa, Stuttgart October 10th, 2007
  • T. Adler, W. Bergholz, N. Fabricius, "Internationale Normung in der Nanotechnologie bei IEC" in "NanoNormung, Normung im Bereich der Nanotechnologien als Chance für hessische Unternehmen", Band 8 der Schriftenreihe der Aktionslinie Hessen-Nanotech des Hessischen Ministeriums für Wirtschaft, Verkehr und Landesentwicklung November 2007, s. 20 - 21

Contribution to Books / Editor activities

  • W. Bergholz, "Analysis of Extended Defects", Chapter in: Landolt Börnstein Handbook of Physics, Neue Serie 22B, M. Schulz ed., Springer Berlin 1988, p. 12
  • W. Bergholz, "Grown-in and Process.Induced Defects", Chapter in F. Shimura:"Oxygen in Silicon", Academic Press 1994
  • "Semiconductor Silicon 1994“, H.R. Huff, W. Bergholz and K. Sumino eds., The Electrochem. Soc., Pennington NJ, 1994
  • O. Baale and W. Bergholz, "Das deutsche Führungsproblem", Deutscher Taschenbuch Verlag, Munich, May 2005